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Friday, Jun 1
2012, 5:47 PM
Chipworks and iFixit perform teardowns of Samsung's (SSNLF.PK) flagship Galaxy S III. Detected...
Chipworks and iFixit perform teardowns of Samsung's (SSNLF.PK) flagship Galaxy S III. Detected parts include an Intel (INTC) baseband processor, a Broadcom (BRCM) Wi-Fi/Bluetooth combo chip and GPS receiver, a Silicon Image (SIMG) video transmitter; a Skyworks (SWKS) power amplifier, a Sony (SNE) image sensor, an Audience (ADNC) voice processor, and Maxim (MXIM) power management chips. The U.S. version will have Qualcomm's (QCOM) MSM8960 baseband/app processor.