Online Event to Highlight Deployments, Case Studies and Market Drivers in Mobile Infrastructure

NEWPORT BEACH, Calif.--(BUSINESS WIRE)-- Mindspeed Technologies, Inc. (NASDAQ: MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that Radisys Corporation will participate in the production of the company's previously-announced webinar detailing developments in the small cell base station sector on Friday, June 29, 2012 at 1:30 p.m. Eastern Time.

Industry veteran Todd Mersch, director, product line management, at Radisys will join Mindspeed (MSPD) speakers Dr. Doug Pulley and Rupert Baines on the program.

The webinar will cover key trends in the small cell base station sector, including mobile broadband industry market drivers and enabling technologies for LTE and 3G. Panelists will discuss case study deployments of small cells and will contrast developments in South Korea, the United States and Europe.

Mindspeed previously revealed progress with operators in the South Korean market when KT announced it had selected Mindspeed®s Transcede® system-on-chip (SoC) baseband processors for its LTE small cell development. The collaboration combines Mindspeeds carrier-grade Transcede SoC baseband processor solutions with KT's development expertise to support the migration to dual mode (LTE and 3G) small cell base stations. Link to press release here.

In addition, Mindspeed announced recently that it has been shortlisted with Contela, Inc. and SK Telecom for a 2012 Small Cell Industry Award in the 'Commercial Deployment' category. The honor recognizes innovation and leadership in small cell deployment by SK Telecom, based on Contela products that are enabled by Mindspeed's industry leading SoC solution. Link to press release here.

Mindspeed's Transcede family of processors leverage Radisys Trillium software and are complete NodeB and eNodeB SoC solutions that support concurrent 3G and LTE processing in a single device, including time division synchronous code division multiple access (TD-SCDMA), wideband code division multiple access (W-CDMA), evolved high-speed packet access (HSPA+) and both frequency division duplexing LTE (FDD-LTE) and time-division duplex long-term evolution (TDD-LTE), with a roadmap to LTE-Advanced (LTE-A). 3G and LTE processing capabilities combined with carrier-class, physical-layer (PHY) software on a single chip, accelerates time to market, while simplifying development and reducing risk.

Press, industry analysts and investors who wish to register for the event should contact Tim Bresien at tim.bresien@mindspeed.com.

The presentation will be webcast live and archived for replay for 30 days on the Investors section of Mindspeed's website at http://www.mindspeed.com.

About Mindspeed Technologies

Mindspeed Technologies is a leading provider of network infrastructure semiconductor solutions to the communications industry. The company's low-power system-on-chip (SoC) products are helping to drive video, voice and data applications in worldwide fiber-optic networks and enable advanced processing for 3G and long-term evolution (LTE) mobile networks. The company's high-performance analog products are used in a variety of optical, enterprise, industrial and video transport systems. Mindspeed's products are sold to original equipment manufacturers (OEMs) around the globe.

To learn more, please visit http://www.mindspeed.com. Company news and updates are also posted at http://www.twitter.com/mindspeed.

Press Relations
U.S.:
Magnet PR Group
Lisa Briggs, +1 949-305-5131
lisab@magnetprgroup.com
or
EMEA and Asia:
EML Wildfire
Darren Willsher, +44 20 8408 8000
mindspeed@emlwildfire.com
or
Investor Relations
Mindspeed Technologies
Kevin Trosian
VP Business Development and Investor Relations
+1 949-579-3111
investor.relations@mindspeed.com
or
Corporate Contact
Mindspeed Technologies
Rupert Baines
VP Corporate Strategy and Marketing Communication
+44 1225 469 744
rupert.baines@mindspeed.com

Source: Mindspeed Technologies

Copyright Business Wire 2012