3S PHOTONICS and Finisar Partner on New Packaging Platform for 980nm Cooled Pump Laser Modules
NOZAY, FRANCE and SUNNYVALE, CA -- (Marketwire) -- 03/12/13 -- 3S PHOTONICS, a world-leading manufacturer in optical and optoelectronic components for telecommunication networks, and Finisar Corporation (FNSR), the world's largest supplier of optical communication components and subsystems, today announced their formal agreement to launch a partnership for the development of a new packaging platform for 980nm cooled laser pump modules.
Under this agreement, 3S PHOTONICS will be the exclusive supplier of the 980nm laser chips used for this platform, and Finisar will implement a manufacturing line based on this platform in its newly expanded facilities in Wuxi, China. Finisar will use these 980nm pump modules in their industry-leading EDFA and Line Card products for the telecom market. 3S PHOTONICS will use the packaging platform to serve its own customers.
Alexandre Krivine, CEO of 3SPGroup, commented: "We are very pleased to launch this agreement which will allow 3S PHOTONICS to gain access to an alternative competitive packaging platform that will improve the fixed cost absorption of our wafer fab. We are proud to be selected as the sole supplier by Finisar for these high power applications, which is recognition of the leading performance and reliability of our 980nm chips."
"This partnership provides Finisar with strategic access to high performance and highly reliable 980nm chips while leveraging our own expertise in high-volume, cost-effective manufacturing," said Eitan Gertel, CEO of Finisar. "This combination allows us to quickly provide the products that our customers are demanding to support growing telecom networks."
The 980nm lasers supplied by 3SPGroup are already fully qualified with outstanding field reliability. The availability of the modules resulting from this new packaging platform is expected by mid-2013.
3SPGroup is a leading provider of innovative optical products and solutions for Lasers, Sensing & Telecom markets. The Group designs, manufactures, and markets high reliability active & passive optical components and modules for the telecom, sensing & laser markets. It develops ultra-reliable fiber-optic systems including high-power fused components, optical sensors and fiber laser components. Through its Avensys Solutions division, it also provides instrumentation and integrated solutions for process and environmental monitoring systems. Eurazeo, one of the leading listed investment companies in Europe, is the majority shareholder of 3SPGroup.
For additional information, visit www.3spgroup.com
Finisar Corporation is a global technology leader of fiber optic subsystems and components that enable high-speed voice, video and data communications for networking, storage, wireless, and cable TV applications. For 25 years, Finisar has provided critical optics technologies to system manufacturers to meet the increasing demands for network bandwidth. Finisar is headquartered in Sunnyvale, California, USA with R&D, manufacturing sites, and sales offices worldwide. For additional information, visit www.finisar.com. Stay up to date with Finisar by reading the Lightspeed blog and connect with us on Twitter, Facebook, and the Finisar YouTube Channel.
Finisar is a registered trademark of Finisar Corporation.
Press Contacts Finisar Corporation Victoria McDonald +1 (408) 542-4261 email@example.com www.finisar.com 3SPGroup Louise Clement +1 (514) -428-6766 # 6803 firstname.lastname@example.org www.3spgroup.com