A Chipworks teardown of Samsung's Galaxy S5 has turned up six Qualcomm (QCOM) chips: Two power management ICs, two RF transceivers, an audio codec IC, and the previously-disclosed Snapdragon 801 baseband/app processor.
Three Avago (AVGO) RF components are also inside the S5, including a 2G/3G/4G module. It's worth noting a phone's RF circuitry can vary depending on the particular market it's being sold into.
Other components include an Audience (ADNC) voice processor, a Lattice Semi (LSCC) FPGA, an RF Micro (RFMD) antenna control chip (the company has strong Galaxy S4 exposure), and a Silicon Image (SIMG) MHL video transmitter IC.
A previous teardown from a Russian site revealed components from Maxim, Synaptics, NXP, InvenSense, and Skyworks (SWKS). Aside from the Skyworks components (apparently swapped out for Avago parts in Chipworks' S5 model), the Chipworks teardown largely turns up the same parts.
Earlier: Snapdragon 600 inside Amazon's Fire TV set-top