- Digitimes reports Samsung (SSNLF, SSNGY) and Globalfoundries have landed orders from Qualcomm and Apple for chips to be made using their next-gen 14nm FinFET (3D transistor) process. Production is expected to start in early 2015.
- Samsung and Globalfoundries inked a FinFET licensing deal this spring in an effort to challenge TSMC's (TSM +2.7%) foundry market hegemony. Qualcomm is a top TSMC client, and Apple (though historically relying on Samsung) is reportedly relying on TSMC to help make its upcoming A8 and A9 CPUs.
- TSMC, which has had an edge in ramping 28nm and (more recently) 20nm chip production, is responding to Samsung/Globalfoundries' challenge with plans to launch a 16nm FinFET process by year's end, and (more importantly) roll out its low-power 16nm FinFET+ process in early 2015.
- TSMC claims 16nm FinFET+ chips will consume 30% less power than 16nm FinFET chips at the same clock speed, and offer 40% better performance than comparable 20nm chips.
- Digitimes states TSMC plans to launch a FinFET+ process "tailored to Apple's requirements," as part of its efforts to manufacture the A9.