TSMC launches low-power IoT/wearable chip processes

• TSMC (NYSE:TSM) has launched a chip manufacturing tech platform meant specifically for ICs going into low-power embedded devices (the proverbial Internet of Things) and wearables.
• Supported manufacturing process nodes range from the dated 180nm and 90nm (useful for chips with RF circuitry and/or embedded flash) to the next-gen 16nm (FinFET). TSMC claims the processes can lower operating voltages by 20%-30% relative to its prior low-power solutions. Risk production is expected to start in 2015.
• TSMC already claims a long list of high-volume mobile chip clients - it includes Qualcomm, Broadcom, MediaTek, Spreadtrum, Nvidia, Cirrus Logic, and Apple. Many of those clients are also aggressively targeting the embedded/wearable space.