- KLA-Tencor (KLAC +3.1%), ASML (ASML +3.3%), Photronics (PLAB +2.5%), Ultratech (UTEK +1.4%), Xcerra (XCRA +1.9%), and Rudolph Technologies (RTEC +2%) are moving higher after Applied Materials (down 7.4%) abandoned its plans to merge with fellow chip equipment giant Tokyo Electron amid tough antitrust scrutiny. The Nasdaq is up 0.5%.
- Not counting divestments, Applied/Tokyo were expected to have ~1/4 of the chip equipment market post-merger, far above #2 ASML's ~15% and #3 Lam Research's ~9%. The unraveling of the deal could be fueling speculation Applied will turn its sights on another target.
- Rudolph reports after the close. KLA is 4 days removed from beating FQ3 estimates, reporting orders ($692M) near the high end of a $500M-$700M guidance range, and announcing plans to lay off ~10% of its workforce. FQ4 guidance was somewhat light: Revenue of $710M-$790M and EPS of $0.78-$1.02 vs. a pre-earnings consensus of $782.7M and $0.99. Orders are expected to total $550M-$750M.