Kulicke & Soffa launches new bonder; shares higher

• Kulicke & Soffa (NASDAQ:KLIC +2.4%) asserts the APAMA C2W, its second chip-to-wafer (C2W) thermo-compression  bonder, delivers "industry-leading throughput, placement accuracy, metrology and cost-of-ownership advantages to the high growth Advanced Packaging market."
• The bonder supports 2.5D and 3D chip packages. Kulicke declares the C2W bonders and the products acquired through its recent acquisition of Dutch chip equipment maker Assembleon give it "a complete offering of advanced packaging solutions ranging FOWLP, Wafer Level Packaging (WLP), Flip Chip, System-in-a-Package ((SiP)), Package-on-Package (PoP), Embedded die and TCB."
• Shares are up in the face of a 2% Nasdaq drop.