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Thursday 6:03 PM Chip contract manufacturer UMC, which has long played second fiddle to larger Taiwanese rival TSMC (TSM), has broken ground on an $8B fab expansion plan that will manufacture chips at cutting-edge process nodes. TSMC has a head start on UMC and other rivals in producing chips using a 28nm process, and is having trouble meeting demand. Chip equipment makers are counting on strong orders from contract manufacturers to offset weak demand elsewhere.
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at MarketWatch.com (May 16, 2012)
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at MarketWatch.com (Apr 26, 2012)
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at MarketWatch.com (Apr 26, 2012)
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at MarketWatch.com (Apr 21, 2012)
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at CNBC.com (Mar 13, 2012)
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PR Newswire (May 3, 2012)
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PR Newswire (Apr 26, 2012)
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PR Newswire (Apr 24, 2012)
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PR Newswire (Apr 23, 2012)
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PR Newswire (Apr 16, 2012)
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Fri, May 11Popular searches: nand, technology.
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Company Description
BUSINESS: The Company
KLA-Tencor Corporation is a leading supplier of process control and yield management solutions for the semiconductor and related nanoelectronics industries. Our products are also used in a number of other industries, including light emitting diode (“LED”), data storage,... More
