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Thursday 6:03 PM Chip contract manufacturer UMC, which has long played second fiddle to larger Taiwanese rival TSMC (TSM), has broken ground on an $8B fab expansion plan that will manufacture chips at cutting-edge process nodes. TSMC has a head start on UMC and other rivals in producing chips using a 28nm process, and is having trouble meeting demand. Chip equipment makers are counting on strong orders from contract manufacturers to offset weak demand elsewhere.
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at MarketWatch.com (May 16, 2012)
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at CNBC.com (May 16, 2012)
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at CNBC.com (May 11, 2012)
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at MarketWatch.com (May 11, 2012)
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at MarketWatch.com (Apr 19, 2012)
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Company Description
Lam Research Corporation is a leading supplier of wafer fabrication equipment and services to the worldwide semiconductor industry. For more than twenty five years, our wafer fabrication equipment, services, and extensive technical expertise have contributed to advancing semiconductor... More
