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EXFO, Inc. (EXFO) Announces Partnership With Artiza Networks To Offer End-to-End Testing Of LTE ENodeB's

|Includes: EXFO Inc. (EXFO)

EXFO announced that it will be entering into a global commercial and technology partnership with the Japanese company Artiza Networks. The objective of the partnership will be to deliver the most complete and advanced line of wireless network simulators, ranging from RF and functional testing, to very-large-scale EPC traffic generation.

Artiza Networks, a market leader in LTE radio access network (RAN), has established cutting-edge eNodeB testing capabilities. EXFO's current QualityAssurer test platforms for IMS, LTE, and EPC work in concert with the eNodeB testing capabilities to provide a complete solution for end-to-end load testing. The DuoSIM test platforms, the wrap-around testing mechanisms for the LTE eNodeB, enable high-capacity simulation of up to six sectors and 1,000 user equipment units (UEs) per sector, resulting in a total of 6000 UEs. In addition, this innovative LTE RAN testing solution is prepared for the LTE Advanced standard.

As a result of the collaboration between the two companies, EXFO now offers an LTE eNodeB wrap around testing solution that delivers the greatest C-plane burst generation capacity in the industry, with up to 500 calls and 300 pages per second. This capability enables top-of-the-line stress testing, producing a significantly more robust live network. The solution's unique ability to choose the RF range with software means that stock hardware can adapt to a different RF range. This combination causes EXFO to be a one-stop shop for true end-to-end LTE network simulation, thanks to a wider, more comprehensive portfolio of solutions.

"I am delighted to announce Artiza as our global commercial and technology partner for offering the world's highest capacity LTE UE simulators-a sector that is mission-critical in radio access network design and optimization," said Germain Lamonde, President and CEO of EXFO. "Combined with our entire line of high-capacity EPC, VoIP, IMS and 3G core simulators, Artiza's products vastly expand the scope of our solutions for leading wireless network equipment manufacturers and mobile operator labs."

"This agreement with EXFO opens the global market for Artiza and builds upon the tremendous success we have enjoyed so far in the Japanese market in massive 3G and LTE UE simulation," said Takashi Tokonami, President and CEO of Artiza Networks. "Global wireless equipment makers and mobile operators will now be well supported with the highest capacity test solutions available today."

The joint EXFO-Artiza solution will be showcased at the upcoming 4G World event in Chicago (NYSE:USA), from October 29 to November 1, 2012.

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