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Cascade Microtech, Inc. (CSCD) Introduces The Industry's First Fully-Integrated Solution For ON-Wafer Power Device Test, The APS200TESLA

|Includes: Cascade Microtech, Inc. (CSCD)

Cascade Microtech, a leading expert at enabling precision measurements of integrated circuits at the wafer level, introduced today its new, innovative, turn-key system, the APS200TESLA. This cutting edge system is the industry's first complete on-wafer production solution addressing the test challenges of discrete power devices. Cascade was able to deliver this capability by combining the proven capabilities of its Tesla on-wafer power device characterization measurement technology with its proprietary BlueRay™ production automation technology.

As power semiconductors grow with the demand for energy-efficient and environmentally-friendly products, power device manufacturing will shift from silicon substrates to silicon carbide (SiC), gallium nitride (GaN), and gallium nitride on silicon (GaN-on-Si). These new substrate technologies offer improved efficiency and enable higher levels of power, as well as faster switching, in many applications using insulated gate bipolar transistors (IGBTs) and MOSFETS, such as automotive and consumer electronics, electrical power distribution, and large data centers.

The need for test solutions explicitly designed for high-voltage/high-current probing will continue to grow as exponentially growing applications in renewable energy and industrial power will require power manufacturers to develop more efficient devices at lower costs. Cascade Microtech meets this need with the first fully-automatic on-wafer probe system for high-power device measurement.

The APS200TESLA is rated up to 10kV/400A and offers unrivaled electrical performance in high-voltage and high-current device characterization applications at production levels. The system comes with a high-voltage/high-current probe card, a high-voltage/high-power chuck port, and the patent-pending MicroVac™ high-power chuck that can handle wafer thicknesses down to 50 µm, such as the ultra-thin Taiko wafers.

An optimized electrical connection effortlessly integrates the APS200TESLA with a wide variety of test instruments. In addition, the interlock-enabled safety shield provides a safe operating environment for the user. The arc-suppression feature allows the customer to achieve better yields through device layout optimization. Finally, the APS200TESLA's auto-discharging and probe-pin touch sensing capabilities prevent high-voltage discharge during die-to-die moves from damaging the device, and advanced prober control software for automatic wafer and die stepping.

"The new APS200TESLA leverages our experience in achieving accurate on-wafer measurement. It is an advanced, turn-key power device measurement system that will help our customers improve cost-of-ownership, increasing test throughput and improving yields," said Michael Burger, president and CEO, Cascade Microtech, Inc. "It allows our customers to save time by avoiding unnecessary dicing and packaging prior to final test. By testing on-wafer in a production environment, the APS200TESLA enables our customers to reduce test costs and get their products to market faster."

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