The news came during the groundbreaking for a new plant building in Hwaseong, South Korea. Construction will finish in 2H19 with full-scale production beginning the next year.
The fab will have extreme ultraviolet (EUV) lithography equipment that can etch circuits 7nm in width or smaller.
Competition: Samsung ranks fourth in contract chipmaking with Taiwan Semiconductor Manufacturing Co. (NYSE:TSM) leading the pack. Samsung hopes to move up to second place.
Taiwan Semiconductor shares are up 2.9% to $43.62.
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