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HENSOLDT and Nano Dimension achieve breakthrough in electronics 3D printing, shares +54%

May 19, 2020 9:29 AM ETNNDMBy: SA News Team11 Comments
  • Until now, 3D printed boards could not bear the soldering process necessary for two-sided population of components.
  • Utilizing a newly developed dielectric polymer ink and conductive ink from Nano Dimension (NASDAQ:NNDM), HENSOLDT succeeded in assembling the world-wide first 10-layer PCB which carries high-performance electronic structures soldered to both outer sides.
  • Press Release

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